Vacuum molding apparatus
AssigneeAsm Technology Singapore Pte Ltd
InventorsZheng Yu Gao, Shu Chuen Ho
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Abstract
A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.
Claims4
A molding apparatus for molding a leadframe, comprising:
- a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area;
- at least one pair of adjacent molding cavities located in the leadframe-receiving area;
- vacuum suction holes formed at least between the pair of molding cavities and located within the leadframe-receiving area, the vacuum suction holes being operative to evacuate air from the mold surface by vacuum suction;
- and
- air vents connecting the vacuum suction holes to the pair of molding cavities.
Dependencies are inferred from the claim text.