Heat sink assembly for multiple electronic components
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsWu-Jiang Ma, Min Li
Life of this patent
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Abstract
A heat sink assembly for removing heat from a plurality arrays of heat generating-components mounted on a printed circuit board includes a fist and a second heat sink, a plurality of fastening assemblies. Each of the first and second heat sinks comprises an elongated base and a plurality of fins mounted on the base. The base extends beyond the fins at two lateral sides of the fins to form a first shoulder and a second shoulder located above the first shoulder in a manner such that the second shoulder of the first heat sink is superposed on the first shoulder of the second heat sink. The fastener assembly extends through the superposed first and second shoulders of the first and second heat sinks to assemble the first and second heat sinks on the printed circuit board.
Claims14
A heat sink assembly for removing heat from a plurality of arrays of heat generating-components mounted on a printed circuit board, comprising:
- two heat sinks each attached to one individual array of the heat-generating components, each of the heat sinks having a first shoulder and a second shoulder respectively extending from two opposite lateral sides thereof;
- a fixture comprising a head and a shaft extending perpendicularly from the head;
- a first spring snugly encircling the shaft;
- and
- a second spring encircling the shaft and surrounding the first spring;
- wherein the fixture further comprises a column between the head and the shaft, and a diameter of the column is larger than that of the shaft and smaller than that of the head;
- wherein the first and second shoulders respectively define a first and second through holes therein;
- wherein the second shoulder of one of the two heat sinks is disposed on the first shoulder of another of the two heat sinks, the fixture extends through the second and the first through holes, the first spring is compressed between the column and the first shoulder, the second spring is compressed between the head and the second shoulder and a top of the second spring is located above a top of the first spring.
A heat sink assembly for removing heat from multiple heat generating-components mounted on a printed circuit board comprising:
- a first heat sink and a second heat sink, each of the first and second heat sinks comprising an elongated base and a plurality of fins mounted on the base, the base extending beyond the fins at two lateral sides of the fins to form a first shoulder and a second shoulder located above the first shoulder in a manner such that the second shoulder of the first heat sink is superposed on the first shoulder of the second heat sink, and the first and second shoulders respectively define a first and second through holes therein;
- and
- a fastener assembly;
- wherein the fastener assembly comprises a fixture, a first spring and a second spring, wherein the fixture comprises a head and a shaft extending perpendicularly from the head, and the first spring snugly encircles the shaft, and the second spring encircles the shaft and surrounds the first spring, and the fixture extends through the first and second through holes of the superposed first and second shoulders to assemble the first and second heat sinks on the printed circuit board.
Dependencies are inferred from the claim text.