Overlay target and measurement method using reference and sub-grids
AssigneeInternational Business Machines Corporation
InventorsChristopher P. Ausschnitt, Jaime D. Morillo
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsChristopher P. Ausschnitt, Jaime D. Morillo
Estimating the term…
A method of determining alignment error in electronic substrates comprises providing on a layer of a substrate a first contrasting set of elements forming a first grid pattern having a plurality of grid segments in the x and y directions. The method also includes providing nested within at least one of the first grid pattern segments, on the same or different layer of a substrate, a second contrasting set of elements forming a second grid pattern having a plurality of grid segments in the x and y directions. The method then includes determining the center of the first set of elements in the first grid pattern and determining the center of the second set of elements in the second grid pattern. The method then comprises comparing the centers of the first and second sets of elements and determining alignment error of the first and second grid patterns.
A metrology tool system comprising a plurality of metrology tools, each metrology tool comprising a stage for securing a lithographically produced semiconductor substrate, an energy source, a lens for directing energy from the energy source onto a surface of the substrate, a lens for capturing an image of a structure lithographically produced on the substrate, and an image processor for measuring distance between points on the image of the lithographically-produced structure on the substrate, each metrology tool stage including an alignment target mounted thereon comprising a first contrasting set of elements forming a first grid pattern having a distance between elements;
Dependencies are inferred from the claim text.