EMI shielding and thermal management assemblies including frames and covers with multi-position latching
AssigneeLaird Technologies, Inc.
InventorsGerald Robert English, Allan Richard Zuehlsdorf
Life of this patent
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Abstract
According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
Claims27
An assembly for providing EMI shielding and dissipating heat from one or more electrical components of a board, the assembly comprising:
- a frame;
- a cover attachable to the frame in a first latched position and at least a second, operational latched position;
- and
- at least one thermally-conductive compliant material;
- wherein, when the cover is attached to the frame in the first latched position, a spaced distance separates the at least one thermally-conductive compliant material from at least one of the cover or the one or more electrical components;
- and
- wherein, when the cover is attached to the frame in the second latched position, the spaced distance is substantially eliminated and the at least one thermally-conductive compliant material forms a thermally-conducting heat path from the one or more electrical components to the cover.
A method for providing board level EMI shielding and thermal management for one or more electrical components of a board, the method comprising:
- attaching a cover to a frame in a first latched position such that a spaced distance separates at least one thermally-conductive compliant material, disposed within an interior defined by the cover and the frame, from at least one of the cover or the one or more electrical components disposed within the interior defined by the cover and the frame, and
- moving the cover relatively downward towards the board from the first latched position into a second, operational latched position in which the spaced distance is substantially eliminated and the at least one thermally-conductive compliant material forms a thermally-conducting heat path from the one or more electrical components to the cover.
An assembly for EMI shielding and thermal management of one or more electrical components of a board, the assembly comprising:
- a frame;
- a cover attachable to the frame;
- a thermal interface/phase change material configured such that:
- before solder reflow of the frame to the board, a spaced distance is provided between the thermal interface/phase change material and the one or more electrical components disposed within an interior defined by the cover and the frame;
- and
- after solder reflow and cooling, displacement of the thermal interface/phase change material and thermal contraction of the cover can cooperatively generate a clamping force for compressing the thermal interface/phase change material generally between the cover and the one or more electrical components, whereby the thermal interface/phase change material forms a thermally-conducting heat path from the one or more electrical components to the cover;
- wherein the cover and the frame are configured such that the cover is attachable to the frame in:
- a first latched position in which a spaced distance separates the thermal interface/phase change material and the one or more electrical components;
- and
- a second, operational latched position in which the thermal interface/phase change material
- contacts the at least a portion of the one or more electrical components and forms a thermally-conducting heat path from the one or more electrical components to the cover.
Dependencies are inferred from the claim text.