Polishing method and polishing device

A polishing device for configured to polish the edge surface of a wafer by using a polishing tape, comprising:

• a wafer holding section to rotatably hold said wafer;
• a polishing liquid supplying section having a first nozzle at a first point along a common radius of the wafer for supplying a first polishing liquid containing an oxidizing agent to the edge surface of sad wafer thereby forming a protective layer via an oxide film on said edge surface of said wafer and a second nozzle at a second point along the common radius of the wafer for supplying a second polishing liquid containing a metal complexing agent to the edge surface of said wafer, the first nozzle and the second nozzle supplying a polishing liquid to different surfaces of said wafer held by said wafer holding section along the common radius of said wafer held by said wafer holding section such that said first polishing liquid with said oxidizing agent and said second polishing liquid with said metal complexing agent are mixed at the edge surface of said wafer;
• a tape holding section to hold said polishing tape under tension so that a front surface of said polishing tape is opposed to the edge surface of said wafer held by said wafer holding section;
• and
• a tape pressing section having a pad to press the front surface of said polishing tape against the edge surface of said wafer held by said wafer holding section from a back surface of said polishing tape to polish said edge surface of said wafer in the presence of said mixed polishing liquids.

A polishing method to polish an edge surface of a wafer by using a polishing tape, the polishing method comprising the steps of:

• applying a first polishing liquid containing an oxidizing agent to a first point along a common radius of a wafer to form a protective layer via an oxide film on said edge surface of said wafer;
• applying a second polishing liquid containing a metal complexing agent to a second point along the common radius of the wafer to form a metal film on said edge surface of said wafer;
• and
• mixing said first polishing liquid with said second polishing liquid at an edge surface of said wafer and polishing said edge surface of said wafer in the presence of the mixed polishing liquids by pressing the polishing tape against said edge surface of said wafer.