Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types

An interposer device comprising:

• a plurality of electrical contacts and at least one compliant optical window for providing electrical and optical interconnection between a first component containing both electrical and optical I/O to a second component with both electrical and optical I/O further including a compliant material surrounding the periphery of the window both above and below the interposer such that when the interposer is brought into contact with a first component above and a second component below said compliant material is disposed against said first and second components.

An interposer comprising:

• electrical and optical connecting components for providing electrical and optical interconnection between a first component containing both electrical and optical I/O to a second component with both electrical and optical I/O wherein said optical connection component comprises a window large enough to accommodate a plurality of optical I/O.

An interposer comprising:

• a plurality of electrical contacts and at least one compliant optical window for providing electrical and optical interconnection between a first component containing both electrical and optical I/O to a second component with both electrical and optical I/O wherein said at least one compliant window has curvature in at least one dimension.

An interposer comprising a plurality of electrical connecting components and a plurality of optical connecting components for connecting a first component containing electrical and optical I/O with a second component having both electrical and optical I/O, wherein said plurality of optical connecting components comprise at least two of the following:

• an opening having a compliant seal about the periphery of the opening, a compliant window material having curvature, a compliant window material having at least one embedded lens, a window material having a compliant seal and a lens.