Probe sensing pads and methods of detecting positions of probe needles relative to probe sensing pads

A probe sensing pad comprising:

• a probe area making contact with a probe needle, wherein the probe area having a rectangular shape including a first side, a second side, a third side and a forth side;
• a first sensing member for detecting whether the probe needle contacts a desired contact site of the probe area or deviates from the desired contact site along a first direction, wherein the first sensing member includes a first sensing region making contact with the first side of the probe area, and a first sensing element electrically connected to the first sensing region;
• a second sensing member for detecting whether the probe needle contacts the desired contact site of the probe area or deviates from the desired contact site along a second direction, wherein the second sensing member includes a second sensing region making contact with the second side of the probe area, and a second sensing element electrically connected to the second sensing region;
• a third sensing member for detecting whether the probe needle contacts the desired contact site of the probe area or deviates from the desired contact site along a third direction, wherein the third sensing member includes a third sensing region making contact with the third side of the probe area, and a third sensing element electrically connected to the third sensing region;
• a fourth sensing member for detecting whether the probe needle contacts the desired contact site of the probe area or deviates from the desired contact site along a fourth direction, wherein the fourth sensing member includes a fourth sensing region making contact with the fourth side of the probe area, and a fourth sensing element electrically connected to the fourth sensing region;
• and
• an isolation member for electrically insulating adjacent sensing regions.

A probe sensing pad in a semiconductor device comprising:

• a probe area adapted for contact with a probe needle, wherein the probe area has a rectangular shape including a first side, a second side, a third side and a forth side;
• a sensing region contacting peripheral portions of the probe area, at least one portion of the sensing region having an area substantially wider than that of the probe area;
• and
• a sensing element electrically coupled to the sensing region for detecting contact of the probe needle on the sensing region as opposed to the probe area.

A method of detecting a position of a probe needle relative to a probe sensing pad in a semiconductor device, comprising:

• contacting a probe needle with the probe sensing pad that comprises a probe area, at least two sensing regions making contact with peripheral portions of the probe area, sensing elements having different electrical characteristics and being connected to corresponding sensing regions, and an isolation member for electrically insulating adjacent sensing regions;
• applying an electrical signal to the probe needle along a forward direction from the probe needle toward a grounded end portion of the probe sensing pad;
• measuring a voltage between the probe needle and the grounded end portion of the probe sensing pad;
• and
• determining a position of the probe needle using the measured voltage.