Ultrasonic probe, backing material for ultrasonic probe, and method of manufacturing the same
AssigneeFUJIFILM Corporation
InventorsShigenori Yuuya, Takashi Nakamura
Life of this patent
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AssigneeFUJIFILM Corporation
InventorsShigenori Yuuya, Takashi Nakamura
Estimating the term…
A backing material that is advantageous in insulation property and can realize a desired acoustic impedance without making the cross-linking and curing reaction of elastomer or resin as a parent material unstable. The backing material is provided on a backside of vibrators for transmitting and/or receiving ultrasonic waves in an ultrasonic probe, and the backing material includes: a parent material containing elastomer or resin and having an insulation property; and composite powder dispersed to fill the parent material, and the composite powder includes powder of a material having a larger acoustic impedance than that of the parent material and an insulation coating for covering a surface of the powder, and the insulation coating contains an oxide of an element of group XIII to group XV except for carbon (C), nitrogen (N), phosphorus (P).
A backing material provided on a backside of vibrators for transmitting and/or receiving ultrasonic waves in an ultrasonic probe, said backing material comprising:
An ultrasonic probe comprising:
A method of manufacturing a backing material provided on a backside of vibrators for transmitting and/or receiving ultrasonic waves in an ultrasonic probe, said method comprising the steps of:
Dependencies are inferred from the claim text.