Multi-chip module and single-chip module for chips and proximity connectors

A mounting structure for a semiconductor die, comprising:

• an opening in the mounting structure configured to receive the semiconductor die, wherein the semiconductor die has a first surface and an a second surface and is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the semiconductor die;
• at least three lithographically defined alignment features within the opening, the alignment features configured to align with corresponding alignment features on the semiconductor die such that the semiconductor die may be positioned in the mounting structure relative to additional proximity connectors with a deviation in a first dimension in a plane of the first surface of the semiconductor die that is less than one half of a pitch of at least a subset of the plurality of the proximity connectors along the first dimension, and the deviation in a second dimension perpendicular to the plane of the first surface of the semiconductor die that is less than a pre-determined value.