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US 7,612,458 B2Granted
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorAtsushi Nakamura
Life of this patent
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Abstract
There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which contains: metal or semimetal other than silicon; and/or an inorganic compound comprising the metal or semimetal other than silicon.
Claims4
An epoxy resin composition for use in semiconductor encapsulating comprising:
- an epoxy resin (A);
- a phenol resin (B);
- a curing accelerator (C);
- and an inorganic filler (D), wherein
- the inorganic filler (D) contains a eutectic mixture (d3) of silicon dioxide and alumina which is a spherical inorganic filler formed by:
- (a) adding aluminum powder to silica material and then thermofusing them;
- or (b) mixing metallic silicon with metallic aluminum and then reacting them with oxygen, wherein
- a content ratio of the silicon dioxide in the eutectic mixture (d3) is not less than 80 weight percent and not more than 99.8 weight percent,
- a content ratio of the alumina in the eutectic mixture (d3) is not less than 0.2 weight percent and not more than 20 weight percent, and
- an extract of the eutectic mixture (d3) has a pH value no less than 3 and no more than 5.
7 more elements
Dependencies are inferred from the claim text.