Semiconductor package including dummy board and method of fabricating the same

A semiconductor package, comprising:

• a semiconductor chip;
• a plurality of conductive balls disposed on a joint surface of the semiconductor chip;
• a dummy board including openings aligned with the conductive balls and bonded to the joint surface of the semiconductor chip, the dummy board supporting side portions of the conductive balls to relieve a stress applied to the conductive balls;
• and
• an adhesive material interposed between the semiconductor chip and the dummy board to adhere the dummy board to the semiconductor chip, wherein the adhesive material comprises a thermoplastic sheet.

A method of fabricating a semiconductor package, the method comprising:

• forming a semiconductor chip having a joint surface;
• forming a plurality of conductive balls on the joint surface of the semiconductor chip;
• forming a dummy board including a plurality of openings corresponding to the conductive balls;
• applying an adhesive material on an adhesion surface of the dummy board;
• and
• adhering the dummy board to the joint surface of the semiconductor chip such that the conductive balls are aligned with the openings, the dummy board supporting side portions of the conductive balls to relieve a stress applied to the conductive balls.