Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner

A power module comprising:

• a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion;
• a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate, a thickness of a portion of the resin substrate on which the power semiconductor device is mounted being thinner than a thickness of a portion of the resin substrate on which the non-power semiconductor device is mounted;
• and
• a cooling device being configured to cool the power semiconductor device.

A power module comprising:

• a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion;
• a mounting substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the mounting substrate, the mounting substrate having a thermal conductivity in a board thickness direction that is 10 W/(m·K) or less;
• and
• a cooling device being configured to cool the power semiconductor device, the cooling device including a cooling fluid passage disposed on a side opposite a mounting surface of the mounting substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface of the mounting substrate, the cooling fluid passage allowing a cooling fluid to cool the power semiconductor device to pass therethrough,
• a shortest distance between the power semiconductor device and the cooling fluid passage being shorter than a shortest distance between the non-power semiconductor device and the cooling fluid passage.

An air conditioner comprising:

• a refrigerant circuit;
• and
• a power module including
• a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion,
• a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate, and
• a refrigerant passage being disposed on a side opposite a mounting surface of the resin substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface, the refrigerant passage allowing refrigerant flowing in the refrigerant circuit to pass therethrough,
• a shortest distance between the power semiconductor device and the refrigerant passage being shorter than a shortest distance between the non-power semiconductor device and the refrigerant passage.

A method of producing a power module comprising:

• fixing a power semiconductor device and a non-power semiconductor device to prescribed positions on a resin substrate;
• connecting the power semiconductor device and a circuit disposed on the resin substrate;
• connecting the non-power semiconductor device and the circuit;
• and
• fixing the resin substrate to a cooling device such that a shortest distance between the power semiconductor device and a cooling fluid passage of the cooling device being shorter than a shortest distance between the non-power semiconductor device and the cooling fluid passage.

A power module comprising:

• a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion;
• a mounting substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the mounting substrate, the mounting substrate having a thermal conductivity in a board thickness direction that is 10 W/(m·K) or less, a thickness of a portion of the mounting substrate on which the power semiconductor device is mounted being thinner than a thickness of a portion of the mounting substrate on which the non-power semiconductor device is mounted;
• and
• a cooling device being configured to cool the power semiconductor device.

An air conditioner comprising:

• a refrigerant circuit;
• and
• a power module including
• a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion,
• a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate, a thickness of a portion of the resin substrate on which the power semiconductor device is mounted being thinner than a thickness of a portion of the resin substrate on which the non-power semiconductor device is mounted, and
• a refrigerant passage being disposed on a side opposite a mounting surface of the resin substrate, the power semiconductor device and the non-power semiconductor device being mounted on the mounting surface, the refrigerant passage allowing refrigerant flowing in the refrigerant circuit to pass therethrough.

A method of producing a power module comprising:

• fixing a power semiconductor device and a non-power semiconductor device to prescribed positions on a resin substrate such that a thickness of a portion of the resin substrate on which the power semiconductor device is mounted is thinner than a thickness of a portion of the resin substrate on which the non-pow semiconductor device is mounted;
• connecting the power semiconductor device and a circuit disposed on the resin substrate;
• connecting the non-power semiconductor device and the circuit;
• and
• fixing the resin substrate to a cooling device.

A power module comprising:

• a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion;
• a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on a mounting surface on a portion of the resin substrate;
• and
• a stepped cooling device contacting the portion of the resin substrate, and contacting only a surface on a side opposite the mounting surface of the portion of the resin substrate on which at least the power semiconductor is mounted.