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US 7,612,443 B1Granted
Inter-chip communication
AssigneeUniversity of Notre Dame du Lac
InventorsGary H. Bernstein, Patrick Fay, Wolfgang Porod, Qing Lui
Life of this patent
Estimating the term…
Abstract
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
Claims46
A microchip comprising:
- a plurality of first interconnect nodules, integrated with one or more edges of the microchip, each configured to make a direct electrical connection with one or more electrical contacts of one or more separate electronic devices, wherein said plurality of first interconnect nodules have at least two different shapes.
A microchip comprising:
- one or more first interconnect nodules each configured to make a direct electrical connection with one or more electrical contacts of one or more separate electronic devices, wherein said one or more first interconnect nodules are integrated with one or more edges of the microchip,
- wherein said one or more first interconnect nodules have a female shape and said one or more electrical contacts have a male shape.
A microchip comprising:
- one or more interconnect nodules each configured to make a direct electrical connection with one or more electrical contacts a separate electronic device,
- wherein said nodules are integrated with one or more edges of the microchip, and wherein at least one of said one or more interconnect nodules is deformable.
Dependencies are inferred from the claim text.