Image-sensing chip package module adapted to dual-side soldering

An image-sensing chip package module adapted to dual-side soldering, comprising:

• a first board unit having a first board, a plurality of first through holes passing through the first board, and a plurality of first conductive bodies respectively formed on inner surfaces of the first through holes and extended from the bottom ends of the inner surfaces of the first through holes to the bottom side of the first board;
• at least one image-sensing chip disposed on the first board of the first board unit, wherein the at least one image-sensing chip is electrically connected to the first conductive bodies;
• a second board unit disposed on the first board unit, and the second board unit having a second board, a first opening for exposing the at least one image-sensing chip, a plurality of second through holes passing through the second board, and a plurality of second conductive bodies respectively formed on inner surfaces of the second through holes, wherein the second through holes correspond to the first through holes, and the second conductive bodies are respectively and electrically connected with the first conductive bodies;
• a third board unit disposed on the second board unit, and the third board unit having a third board, a second opening corresponding to the first opening, a plurality of third through holes passing through the third board, and a plurality of third conductive bodies respectively formed on inner surfaces of the third through holes and extended from the top ends of the inner surfaces of the third through holes to the top side of the first board, wherein the third through holes correspond to the second through holes, and the third conductive bodies are respectively and electrically connected with the second conductive bodies;
• a package colloid filled into the first opening;
• and
• a filter lens received in the second opening.