Electronic device having wiring substrate and lead frame

An electronic device comprising:

• a wiring substrate;
• a first electric part disposed on the wiring substrate;
• a lead frame connected to the wiring substrate through a conductive bonding material;
• and
• a second electric part, wherein
• the wiring substrate includes a groove corresponding to a connection portion between the wiring substrate and the lead frame,
• the lead frame is connected to the substrate in such a manner that one end of the lead frame is engaged in the groove through the conductive bonding material,
• the lead frame has a surface, which is opposite to the connection portion,
• the second electric part is disposed on the surface of the lead frame, and
• the second electric part electrically connects to the wiring substrate.