Semiconductor device having self-aligned contact
AssigneePowerchip Semiconductor Corp.
InventorsMin-San Huang, Hann-Jye Hsu, Yung-Chung Yao
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AssigneePowerchip Semiconductor Corp.
InventorsMin-San Huang, Hann-Jye Hsu, Yung-Chung Yao
Estimating the term…
A method of manufacturing semiconductor devices having self-aligned contacts is provided. Multiple isolation structures are formed on the substrate to define an active area. Multiple gate structures are formed on the substrate. Multiple doped areas are formed in the substrate beside each gate structure. Multiple first spacers are formed on the sidewalls of each of the gate structure. Multiple second spacers are formed on the sidewalls of each of the isolation structure. A dielectric layer is formed on the substrate. Then, a self-aligned process is performed to form multiple contact openings in the dielectric layer between the gate structures. The conductive material is filled in the contact openings.
A semiconductor device having self-aligned contacts, comprising:
Dependencies are inferred from the claim text.