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US 7,612,296 B2Granted
Visually inspectable surface mount device pad
AssigneeSynergy Microwave Corporation
InventorsMeta Rohde, Ajay Kumar Poddar, Klaus Juergen Schoepf, Reimund Rebel
Life of this patent
Estimating the term…
Abstract
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.
Claims13
A circuit board assembly, comprising:
- a first substrate having a planar surface and at least one solder pad disposed thereon;
- and
- a second substrate having a planar surface and a circuit pad disposed along an edge of the planar surface, the circuit pad having two separate vias arranged therethrough and fully disposed in the circuit pad,
- wherein the second substrate is mounted onto the planar surface of the first substrate with the circuit pad disposed above the solder pad such that the solder pad is arranged beneath the separate vias and viewable through the vias, and
- wherein the configuration of the size and shape of the circuit pad and the location of the via comprises a connection having a constant impedance transformation.
2 more elements
An interconnection product manufactured by the steps of:
- forming at least one conductive track on an insulator;
- forming a pad along an edge of the insulator and at an end of the at least one conductive track such that a via formed in the pad is are positioned within the pad and away from the edge of the insulator, wherein the configuration of the size and shape of the circuit pad and the location of the via comprises a connection having a constant impedance transformation;
- and
- soldering at least a portion of the via in the pad to a connection pad of a substrate.
1 more element
An interconnection system, comprising:
- a mounting board including solder pads;
- and
- a circuit board having at least one edge, one or more circuit pads disposed along the at least one edge and at least two separate through holes disposed along the at least one edge, each through hole being disposed entirely within a circuit pad,
- the circuit board being arranged on the mounting board such that at least one circuit pad is located above a first solder pad with the through holes associated with the at least one circuit pad arranged to provide a passageway to the first solder pad,
- wherein the configuration of the size and shape of the circuit pad and the location of the via comprises a connection having a constant impedance transformation.
2 more elements
An interconnection system, comprising:
- a mounting board including solder pads;
- and
- a circuit board having at least one edge, one or more circuit pads disposed along the at least one edge and one or more through holes disposed along the at least one edge, each through hole being disposed entirely within a circuit pad, wherein the configuration of the size and shape of the circuit pad and the location of the via comprises a connection having a constant impedance transformation, and
- the circuit board being arranged on the mounting board such that at least one circuit pad is located above a first solder pad with the through hole associated with the at least one circuit pad arranged to provide a passageway to the first solder pad.
1 more element
Dependencies are inferred from the claim text.