Deposition methods for barrier and tungsten materials
AssigneeApplied Materials, Inc.
InventorsKi Hwan Yoon, Yonghwa Chris Cha, Sang Ho Yu, Hafiz Farooq Ahmad, Ho Sun Wee
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AssigneeApplied Materials, Inc.
InventorsKi Hwan Yoon, Yonghwa Chris Cha, Sang Ho Yu, Hafiz Farooq Ahmad, Ho Sun Wee
Estimating the term…
Embodiments as described herein provide a method for depositing barrier layers and tungsten materials on substrates. In one embodiment, a method for depositing materials is provided which includes forming a barrier layer on a substrate, wherein the barrier layer contains a cobalt silicide layer and a metallic cobalt layer, exposing the barrier layer to a soak gas containing a reducing gas during a soak process, and forming a tungsten material over the barrier layer. In one example, the barrier layer may be formed by depositing a cobalt-containing material on a dielectric surface of the substrate and annealing the substrate to form the cobalt silicide layer from a lower portion of the cobalt-containing material and the metallic cobalt layer from an upper portion of the cobalt-containing material.
A method for depositing materials on a substrate, comprising:
A method for depositing materials on a substrate, comprising:
A method for depositing materials on a substrate, comprising:
Dependencies are inferred from the claim text.