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US 7,611,985 B2Granted
Formation of holes in substrates using dewetting coatings
AssigneeIntel Corporation
InventorsJames C. Matayabas, Jr., Lakshmi Supriya
Life of this patent
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Abstract
Methods and systems for forming holes in a substrate using dewetting coating are described herein.
Claims22
A method, comprising:
- placing dewetting coating at one or more selected locations on a surface of a substrate and leaving one or more unselected locations of the surface of the substrate uncoated;
- depositing a dielectric layer on the coated and uncoated locations of the surface of the substrate;
- forming preliminarily one or more holes in portions of the dielectric layer over the one or more selected locations with dielectric layer lips disposed around each of the one or more preliminarily formed holes;
- and
- finalizing formation of the one or more holes including removing the dielectric layer lips.
2 more elements
A method, comprising:
- placing dewetting coating at one or more selected locations on a surface of a substrate, and leaving one or more unselected locations of the surface of the substrate uncoated;
- depositing a dielectric layer on the coated and uncoated locations of the surface of the substrate;
- forming one or more holes in portions of the dielectric layer over the one or more coated locations including removal of the coatings;
- and
- depositing conductive material into the one or more holes to form one or more conductive interconnects.
2 more elements
A method, comprising:
- patterning a substrate to form one or more conductive interconnects;
- placing dewetting coating at one or more selected locations on a surface of the substrate, leaving one or more unselected locations uncoated;
- depositing a dielectric layer on the selected and unselected locations of the surface of the substrate;
- forming preliminarily one or more holes in portions of the dielectric layer over the one or more selected locations with dielectric layer lips disposed around each of the one or more preliminarily formed holes;
- and
- finalizing forming of the one or more holes including removing the dielectric layer lips.
3 more elements
Dependencies are inferred from the claim text.