Semiconductor device and a manufacturing method of the same
AssigneeFujitsu Microelectronics Limited
InventorAkihito Nishimura
Life of this patent
Estimating the term…
Loading patent…
AssigneeFujitsu Microelectronics Limited
InventorAkihito Nishimura
Estimating the term…
A first BPSG film covering a transistor is formed. Next, a second BPSG film is formed on the first BPSG film. The B concentration in the first BPSG film is about five times higher than the B concentration in the second BPSG film. Next, the first BPSG film is separated into a part of a source diffusion layer side and a part of a drain diffusion layer side, with a gate electrode being a boundary. Subsequently, a contact hole reaching the source diffusion layer is formed in the first and second BPSG films. Then, by removing the first BPSG film exposed to the contact hole by isotropic etching, a hollow portion is formed between the source diffusion layer and the second BPSG film. Then, a barrier metal film made of TiN or the like is formed in the hollow portion.
A semiconductor device comprising:
A manufacturing method of a semiconductor device, comprising:
A manufacturing method of a semiconductor device, comprising:
Dependencies are inferred from the claim text.