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US 7,611,966 B2Granted
Dual pulsed beam laser micromachining method
AssigneeIntel Corporation
InventorsEric J. Li, Sergei L. Voronov, Christopher L. Rumer
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Abstract
A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser melts portions of the workpiece prior to a second laser ablating the portions of the workpiece.
Claims17
A method comprising:
- heating a portion of a semiconductor street region with a first energy source;
- softening said portion with the first energy source so as to melt said portion of said street region without substantial evaporation of materials of said portion;
- and
- ablating the melted portion with a second energy source.
1 more element
Dependencies are inferred from the claim text.