Semiconductor device and manufacturing method thereof

A method for manufacturing a semiconductor device, comprising:

• forming a separation layer over a substrate;
• forming an element-forming layer by the steps comprising:
• forming a semiconductor layer over the separation layer;
• forming a gate insulating layer by an inorganic insulator over the semiconductor layer;
• forming a gate electrode over the gate insulating layer;
• forming an organic insulating layer over the gate electrode, partially exposing the semiconductor layer and the gate insulating layer by partially removing the organic insulating layer;
• forming a wire to be connected to the semiconductor layer over the organic insulating layer;
• forming a first electrode layer to be connected to the wire;
• forming an organic insulating layer covering an end portion of the first electrode layer;
• forming a layer containing an organic compound over a part of the organic insulating layer and an exposed portion of the first electrode layer, and
• forming a second electrode layer which is provided over the layer containing an organic compound and is in contact with the layer containing an organic compound and the gate insulating layer;
• and
• attaching a first flexible substrate over the second electrode layer;
• and
• separating the substrate from the element-forming layer from each other at the separation layer so that the element-forming layer is supported by the first flexible substrate.

A method for manufacturing a semiconductor device, comprising:

• forming a separation layer over a substrate;
• forming an element-forming layer by the steps comprising:
• forming an insulating layer over the separation layer;
• forming a semiconductor layer over the insulating layer;
• forming a gate insulating layer by an inorganic insulator over the semiconductor layer;
• forming a gate electrode and a first conductive layer over the gate insulating layer;
• forming an organic insulating layer over the gate electrode and the first conductive layer;
• partially exposing the semiconductor layer and the first conductive layer by selectively removing the organic insulating layer;
• forming a wire to be connected to the semiconductor layer over the organic insulating layer;
• and
• forming a second conductive layer to be connected to the first conductive layer;
• forming a first electrode layer to be connected to the wire and forming a third conductive layer to be connected to the second conductive layer;
• forming an organic insulating layer covering end portions of the first electrode layer and the third conductive layer;
• forming a layer containing an organic compound over apart of the organic insulating layer and an exposed portion of the first electrode layer;
• and
• forming a second electrode layer which is provided over the layer containing an organic compound and is in contact with the layer containing an organic compound and at least one of the first to third conductive layers;
• and
• attaching a first flexible substrate over the second electrode layer;
• and
• separating the substrate and the element-forming layer from each other at the separation layer so that the element-forming layer is supported by the first flexible substrate.

A method for manufacturing a semiconductor device, comprising:

• forming a separation layer over a substrate;
• forming an element-forming layer by the steps comprising:
• forming a semiconductor layer over the separation layer;
• forming a gate insulating layer by an inorganic insulator over the semiconductor layer;
• forming a gate electrode over the gate insulating layer;
• forming an organic insulating layer over the gate electrode, partially exposing the semiconductor layer and the gate insulating layer by partially removing the organic insulating layer;
• forming a wire to be connected to the semiconductor layer over the organic insulating layer;
• forming a first electrode layer to be connected to the wire;
• forming an organic insulating layer covering an end portion of the first electrode layer;
• forming a layer containing an organic compound over a part of the organic insulating layer and an exposed portion of the first electrode layer, and
• forming a second electrode layer which is provided over the layer containing an organic compound and is in contact with the layer containing an organic compound and the gate insulating layer;
• and
• attaching a first flexible substrate over the second electrode layer;
• and
• separating the substrate from the element-forming layer from each other at the separation layer so that the element-forming layer is supported by the first flexible substrate.

A method for manufacturing a semiconductor device, comprising:

• forming a separation layer over a substrate;
• forming an element-forming layer by the steps comprising:
• forming an insulating layer over the separation layer;
• forming a semiconductor layer over the insulating layer;
• forming a gate insulating layer by an inorganic insulator over the semiconductor layer;
• forming a gate electrode and a first conductive layer over the gate insulating layer;
• forming an organic insulating layer over the gate electrode and the first conductive layer;
• partially exposing the semiconductor layer and the first conductive layer by selectively removing the organic insulating layer;
• forming a wire to be connected to the semiconductor layer over the organic insulating layer;
• and
• forming a second conductive layer to be connected to the first conductive layer;
• forming a first electrode layer to be connected to the wire and forming a third conductive layer to be connected to the second conductive layer;
• forming an organic insulating layer covering end portions of the first electrode layer and the third conductive layer;
• forming a layer containing an organic compound over a part of the organic insulating layer and an exposed portion of the first electrode layer;
• and
• forming a second electrode layer which is provided over the layer containing an organic compound and is in contact with the layer containing an organic compound and at least one of the first to third conductive layers;
• and
• attaching a first flexible substrate over the second electrode layer;
• and
• separating the substrate and the element-forming layer from each other at the separation layer so that the element-forming layer is supported by the first flexible substrate.