Method of manufacturing a thin film transistor
AssigneeSamsung Electronics Co., Ltd.
InventorsHuaxiang Yin, Wenxu Xianyu, Takashi Noguchi, Hans S. Cho, Ji-sim Jung
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Abstract
A method of manufacturing a thin film transistor is provided. The method includes forming an amorphous silicon layer on a substrate, forming a source region, a drain region, and a region of a plurality of channels electrically interposed between the source region and the drain region by patterning the amorphous silicon layer, annealing a region of the channels, sequentially forming a gate oxide film and a gate electrode on a channel surface, and doping the source region and the drain region.
Claims16
A method of manufacturing a thin film transistor, comprising:
- forming an amorphous silicon layer on a substrate;
- patterning the amorphous silicon layer to form a monolithic amorphous silicon pattern, the patterning including:
- forming a plurality of amorphous channels each having first ends and second ends,
- forming an amorphous source region integral with the first ends of each of the amorphous channels, and
- forming an amorphous drain region integral with the second ends of each of the amorphous channels, such that the monolithic amorphous silicon pattern includes the plurality of amorphous channels interposed between the source region and the drain region;
- after patterning the amorphous silicon layer, applying a laser beam to the plurality of amorphous channels thereby converting the plurality of amorphous channels to a crystalline state;
- sequentially forming a gate oxide film and a gate electrode on the plurality of crystallized channels;
- and
- doping the source region and the drain region.
Dependencies are inferred from the claim text.