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US 7,611,926 B2Granted
Thermosetting die bonding film
AssigneeNitto Denko Corporation
InventorsNaohide Takamoto, Sadahito Misumi, Takeshi Matsumura, Yasuhiro Amano, Masami Oikawa, Tsubasa Miki
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Abstract
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.
Claims15
A thermosetting die bonding film used to produce a semiconductor device,
- which comprises, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and
- has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.
Dependencies are inferred from the claim text.