Method and apparatus for forming stacked die and substrate structures for increased packing density
AssigneeInternational Business Machines Corporation
InventorsBenjamin V. Fasano, Brian R. Sundlof
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Abstract
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.
Claims9
A method for forming a stacked semiconductor apparatus, the method comprising:
- attaching at least one die to a first side of a carrier substrate;
- attaching a first circuitized substrate to said first side of said carrier substrate so as to overlie said at least one die attached to said first side of said carrier substrate in a manner such that said first circuitized substrate serves as an electrical interconnection device and a heat spreading lid;
- and
- configuring said first circuitized substrate further so as to facilitate cooling of said at least one die attached to said first side of said carrier substrate by at least the introduction of a cross flow of a cooling medium therethrough.
Dependencies are inferred from the claim text.