US 7,611,757 B1 · Method to improve mechanical strength of low-K dielectric film using modulated UV exposure

Abstract

Methods and apparatus for improving mechanical properties of a dielectric film on a substrate are provided. In some embodiments, the dielectric film is a carbon-doped oxide (CDO). The methods involve the use of modulated ultraviolet radiation to increase the mechanical strength while limiting shrinkage and limiting any increases in the dielectric constant of the film. Methods improve film hardness, modulus and cohesive strength, which provide better integration capability and improved performance in the subsequent device fabrication procedures such as chemical mechanical polishing (CMP) and packaging.

Claims20

Dependent claims

A method of processing a substrate, comprising

(a) introducing a processing gas comprising an organosilicon compound into a processing chamber;
(b) reacting the processing gas to deposit a first dielectric layer, wherein the first dielectric layer comprises silicon, carbon, and dopant;
and
(c) curing the first dielectric layer with modulated ultraviolet curing radiation;
wherein one or more mechanical properties of the dielectric layer is improved;
and
wherein the modulated ultraviolet curing radiation modulates one or more of wavelength, substrate temperature, and spectral distribution with a period of between about 1 millisecond and 30 seconds.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/824,049Filed 28 Jun 2007 · continuation

Priority

16 Apr 2004

Granted

3 Nov 2009

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10P 14/6538
By exposure to radiation, e.g. visible light: by exposure to UV light
H10P 95/00
Generic processes or apparatus for manufacture or treatments not covered by the
H10P 14/6336
Using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition: in the presence of a plasma [PECVD]
H10P 14/665
Characterised by the type of materials: porous materials

Method to improve mechanical strength of low-K dielectric film using modulated UV exposure

Life of this patent

Method to improve mechanical strength of low-K dielectric film using modulated UV exposure

Life of this patent

Abstract

Claims20