Method and apparatus

Apparatus for substantially sealing a throughbore of a tubular, the tubular having a line running therethrough, such that the sealed throughbore can withstand a pressure differential, the apparatus comprising:

• an enclosing mechanism to enclose the line and seal an enclosed portion of the throughbore around the line in use;
• a fluid suspension containing a suspension of solid particles, wherein the solid particles are adapted to settle out of suspension in response to a pressure drop in the fluid suspension;
• and
• at least one injector, wherein the or each injector is configured to inject the fluid suspension containing solid particles into the enclosed portion of the throughbore at a higher pressure than the ambient pressure in the enclosed portion of the throughbore, whereby the pressure of the fluid suspension drops during injection, causing the solid particles to settle out of suspension after injection such that the remaining portion of the throughbore is capable of being sealed using the solid particles.

A method of substantially sealing a throughbore of a tubular by substantially filling voids in the throughbore of the tubular, the tubular having a line running therethrough, the method comprising:

• defining an enclosed portion of the throughbore by applying an enclosing mechanism around the line and sealing a portion of the throughbore around the enclosed region of the line;
• injecting a first fluid into the enclosed portion of the throughbore thereby causing the first fluid to fill the voids, wherein the first fluid comprises a grease;
• injecting a second fluid into the enclosed portion of the throughbore, thereby causing the solid particles in the second fluid to fill the voids, wherein the second fluid comprises a fluid suspension containing solid particles;
• and
• causing a pressure drop in the second fluid after being injected into the enclosed region, thereby causing the solid particles in the second fluid to settle out of suspension from the second fluid after the second fluid has filled the voids.