Cooler module
OwnerTsung-Hsien Huanginventor
Life of this patent
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Abstract
A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the radiation fins and partially fitted into respective bottom open grooves of the base block with a respective flat wall portion thereof kept in flush with the bottom wall of the base block, and a thermal pad affixed to the bottom wall of the base block to hold down the heat pipes in the bottom open grooves of the base block for transferring heat energy from an external electronic chip to the heat pipes and the heat sink for quick dissipation.
Claims13
A cooler module, comprising a heat sink formed of a stack of radiation fins, a base block attached to said heat sink, a plurality of heat pipes tightly inserted through the radiation fins of said heat sink and closely attached to said base block, and a thermal pad fastened to said base block to hold down said heat pipes, wherein:
- said base block is a metal block, having a top wall fitting one side of said heat sink, a plurality of bottom open grooves formed on a bottom wall thereof, and a plurality of clamping ribs respectively extending along two opposite sides of each of said bottom open grooves, said clamping ribs each having a longitudinal cut;
- said heat pipes each have a mounting part tightly fitted into said bottom open grooves of said base block and a flat wall portion formed on said mounting part and kept in flush with the bottom wall of said base block;
- and
- said thermal pad is a thin sheet of metal fixedly fastened to the bottom wall of said base block to hold down said heat pipes in said bottom open grooves and kept in close contact with the bottom wall of said base block.
Dependencies are inferred from the claim text.