Upgradable memory system with reconfigurable interconnect
AssigneeRambus Inc.
InventorsRichard E. Perego, Frederick A. Ware, Ely K. Tsern, Craig E. Hampel
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Abstract
Described herein is a point-to-point memory communications architecture, having a point-to-point signal line set associated with each of a plurality of connectors or module positions. When the system is fully populated, there is a one-to-one correspondence between signal line sets and memory modules. In systems that are not fully populated, the system is configurable to use a plurality of the signal line sets for a single memory module.
Claims74
A signal interconnect system for use with one or more modules, the signal interconnect system comprising:
- a first connector configured to receive a first module having a first set of storage cells;
- a second connector configured to receive a second module having a second set of storage cells;
- first and second signal line sets that are usable in at least two configurations, the configurations comprising:
- a first configuration in which the first and second signal line sets are coupled to the first connector and transferring data to ones of the first set of storage cells on the first module;
- and
- a second configuration in which the first signal line set is coupled to the first connector and transferring data to ones of the first set of storage cells on the first module, and the second signal line set is coupled to the second connector and transferring data to ones of the second set of storage cells on the second module while the first signal line set is transferring data to the ones of the first set of storage cells on the first module.
A signal interconnect system for use with one or more modules, the signal interconnect system comprising:
- first and second connectors;
- a first signal line set coupled to the first connector for communications with a first module that is receivable by the first connector;
- a second signal line set coupled to the second connector;
- a third signal line set coupled to the first connector;
- the second and third signal line sets being usable in at least two configurations, comprising:
- a first configuration in which the second signal line set is coupled to the first connector through the third signal line set for communications with the first module and in which the first signal line set communicates with a first set of storage cells on the first module while the third signal line set communicates with a second set of storage cells on the first module;
- a second configuration in which the second signal line set is coupled exclusively to the second connector for communications with a second module that is receivable by the second connector, and in which the second signal line set transfers data to ones of the second set of storage cells on the second module while the first signal line set transfers data to the ones of the first set of storage cells on the first module.
A signal interconnect system for use with one or more modules, the signal interconnect system comprising:
- first and second connectors;
- a first signal line set coupled to the first connector for communications with a first module, in the first connector, that includes a first set of storage cells;
- a second signal line set coupled to the second connector;
- a third signal line set coupled to the first connector;
- the second and third signal line sets being usable in at least two configurations, comprising:
- a first configuration in which the second signal line set is coupled to the first connector through the third signal line set for communications with the first module and in which the first signal line communicates with the first set of storage cells on the first module while the third signal line set communicates with the first set of storage cells on the first module;
- a second configuration in which the second signal line set is coupled exclusively to the second connector for communications with a second module that includes a second set of storage cells and is receivable by the second connector, and in which the first signal line set communicates with the first set of storage cells on the first module while the second signal line set communicates with the second set of storage cells on the second module;
- wherein the first module is alternatively configurable to (a) transfer information through the first and third signal line sets, or (b) transfer information through only the first signal line set.
A signal interconnect system for use with one or more modules, the signal interconnect system comprising:
- first and second connectors;
- a first signal line set coupled to the first connector for communications with a first module that is receivable by the first connector;
- a second signal line set coupled to the second connector;
- a third signal line set coupled to the first connector;
- the second and third signal line sets being usable in at least two configurations, comprising:
- a first configuration in which the second signal line set is coupled to the first connector through the third signal line set for communications with the first module and in which the first signal line communicates with a first set of storage cells on the first module while the third signal line set communicates with the first set of storage cells on the first module;
- and
- a second configuration in which the second signal line set is coupled exclusively to the second connector for communications with a second module that includes a second set of storage cells and is receivable by the second connector, and in which the first signal line set communicates with the first set of storage cells on the first module while the second signal line set communicates with the second set of storage cells on the second module;
- wherein the first module is responsive to one or more signals received through the first connector to (a) transfer information through the first and third signal line sets, or (b) transfer the information through only the first signal line set.
A signal interconnect system for use with one or more modules, the signal interconnect system comprising:
- first and second connectors;
- a first signal line set coupled to the first connector for communications with a first module that is receivable by the first connector;
- a second signal line set coupled to the second connector;
- a third signal line set coupled to the first connector;
- the second and third signal line sets being usable in at least two configurations, comprising:
- a first configuration in which the second signal line set is coupled to the first connector through the third signal line set for communications with the first module and in which the first signal line communicates with a first set of storage cells on the first module while the third signal line set communicates with the first set of storage cells on the first module;
- a second configuration in which the second signal line set is coupled exclusively to the second connector for communications with a second module that includes a second set of storage cells and is receivable by the second connector, and in which the first signal line set communicates with the first set of storage cells on the first module while the second signal line set communicates with the second set of storage cells on the second module;
- and
- the first module comprising a memory device;
- wherein the memory device is programmable to (a) transfer information through the first and third signal line sets, or (b) transfer the information through only the first signal line set.
A signal interconnect system for use with one or more modules, the signal interconnect system comprising:
- first and second connectors;
- a first signal line set coupled to the first connector for communications with a memory device, having a first set of storage cells, on a first module that is receivable by the first connector;
- a second signal line set coupled to the second connector;
- a third signal line set coupled to the first connector;
- the second and third signal line sets being usable in at least two configurations, comprising:
- a first configuration in which the second signal line set is coupled to the first connector through the third signal line set for communications with the first module and in which the first signal line set communicates with the first set of storage cells on the first module while the third signal line set communicates with the first set of storage cells on the first module;
- and
- a second configuration in which the second signal line set is coupled exclusively to the second connector for communications with a second module that includes a second set of storage cells and is receivable by the second connector, and in which the first signal line set communicates with the first set of storage cells on the first module while the second signal line set communicates with the second set of storage cells on the second module;
- wherein the memory device is responsive to one or more received signals to (a) transfer information through the first and third signal line sets, or (b) transfer information through only the first signal line set.
A data interconnect system for use with one or more modules, the data interconnect system comprising:
- one or more connectors that form at least first, second, third, and fourth contact groups;
- a first signal line set coupled to the second contact group;
- and
- a second signal line set coupled to the third contact group;
- the one or more connectors being configured to receive modules in at least two configurations:
- a first configuration in which a single received module mates with the second and third contact groups, wherein the single received module simultaneously communicates via the first and second signal line sets;
- and
- a second configuration in which a first received module mates with the first and second contact groups and a second received module mates with the third and fourth contact groups, wherein the first and second received modules simultaneously communicate via the respective first and second signal line sets.
A signal interconnect system for use with one or more installable modules, the signal interconnect system comprising:
- one or more connectors configured to receive the one or more installable modules;
- at least two sets of signal lines extending to the one or more connectors for electrical communication with the one or more received installable modules;
- the sets of signal lines being alternatively configurable to (a) support a single-module configuration in which data is simultaneously transferred separately to different sets of storage cells on a single received installable module or (b) support a multi-module configuration in which data is simultaneously transferred respectively to different received installable modules.
A configurable memory system comprising:
- a. a memory controller;
- b. at least one electrical connector adapted to receive a plurality of memory modules, including a first memory module having a first memory array and a second memory module having a second memory array;
- c. a first set of data lines extending between the memory controller and the at least one electrical connector;
- d. a second set of data lines extending between the memory controller and the at least one electrical connector;
- e. the memory system supporting a plurality of memory configurations, including:
- i. a first memory configuration in which the first memory module is in physical contact with the at least one electrical connector and coupled to the memory controller via the first and second sets of data lines;
- and
- ii. a second memory configuration in which the first memory module is in physical contact with the at least one electrical connector and coupled to the memory controller via the first set of data lines and the second memory module is in physical contact with the at least one electrical connector and coupled to the memory controller via the second set of data lines;
- iii. wherein the memory controller, in the second memory configuration, simultaneously transfers data to the first and second memory arrays of the respective first and second memory modules.
A circuit board comprising:
- a circuit substrate supporting first and second signal-line sets;
- a controller mounted to the circuit substrate and connected to the first and second signal-line sets;
- and
- first and second connectors, mounted to the circuit substrate, to receive respective removable logic modules;
- wherein the circuit board supports a plurality of logic-module configurations, including:
- a dual-module configuration in which the first signal-line set forms a first plurality of point-to-point connections with a first of the removable modules installed in the first connector and is disconnected from a second of the removable logic modules installed in the second connector, the second signal-line set is disconnected from the installed first removable logic module and the second signal-line set forms a second plurality of point-to-point connections with a second of the removable modules the installed second removable logic module in the second connector, wherein the first and second removable modules communicate simultaneously over the respective first and second signal-line sets;
- and
- a single-module configuration in which the first and second signal-line sets form a third plurality of point-to-point connections with a single one of the removable logic modules installed in one of the first and second connectors;
- wherein the single one of the removable modules communicates simultaneously over the first and second signal-line sets.
A method for supporting single-module and multi-module interconnect topologies on a single circuit board, the method comprising:
- providing a circuit substrate with first and second signal-line sets;
- mounting a controller to the circuit substrate and connecting the controller to the first and second signal-line sets;
- mounting first and second connectors to the circuit substrate, wherein the first and second connectors are to receive respective removable modules, and wherein the circuit board includes the substrate, the controller, the signal-line sets, and the connectors;
- determining whether the circuit board is to be used in the single-module interconnect topology or the multi-module interconnect topology;
- and
- if the circuit board is to be used in the multi-module interconnect topology, installing a first of the removable modules in the first connector and a second of the removable modules in the second connector, forming a first plurality of point-to-point connections between the controller and the first of the removable modules via the first signal-line set and the first connector, and forming a second plurality of point-to-point connections between the controller and the second of the removable modules via the second signal-line set and the second connector;
- wherein the first and second pluralities of point-to-point connections are to convey information from the controller to the first and second removable modules simultaneously over the respective first and second pluralities of point-to-point connections in the multi-module interconnect topology;
- and
- if the circuit board is to be used in the single-module interconnect topology, installing a single one of the removable modules in the first connector, and forming a single plurality of point-to-point connections between the controller and the single one of the removable modules via the first and second signal-line sets and the first connector;
- wherein the first and second pluralities of point-to-point connections are to convey information from the controller to the single one of the removable modules simultaneously over the first and second pluralities of point-to-point connections in the single-module interconnect topology.
Dependencies are inferred from the claim text.