Electronic module
AssigneeImbera Electronics Oy
InventorsRisto Tuominen, Petteri Palm
Life of this patent
Estimating the term…
Abstract
An electronic module in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.
Claims27
An electronic module, comprising:
- a first conductive-pattern layer having a first surface,
- first solid contact bumps solderlessly made on the first surface of the first conductive-pattern layer and metallurgically and electrically connected thereto,
- a component having flat contact zones,
- second solid contact bumps solderlessly made on the flat contact zones and metallurgically and electrically connected thereto, and
- an insulating-material layer on the first surface of the first conductive-pattern layer,
- wherein the component is embedded in the insulating-material layer and wherein the second solid contact bumps made on the flat contact zones of the component are metallurgically, electrically and solderlessly connected to the first solid contact bumps made on the first surface of the first conductive-pattern layer.
An electronic module, comprising:
- a first conductive-pattern layer having a first surface,
- a second conductive-pattern layer having a second surface,
- an insulating-material layer between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer,
- first solderless contact bumps made on the first surface of the first conductive-pattern layer and metallurgically and electrically connected thereto,
- a component having fiat contact zones embedded in the insulating-material layer,
- second solderless contact bumps made on the flat contact zones and metallurgically and electrical connected thereto, and
- wherein the flat contact zones of the component are metallurgically, electrically and solderlessly connected to the first solderless contact bumps made on the first surface of the first conductive-pattern layer by means of the second solderless contact bumps made on said flat contact zones.
A multi-layered electronic module, comprising a plurality of electronic modules attached on top of each other, wherein at least one of the modules of said plurality comprises:
- a first conductive-pattern layer having a first surface,
- first solderless contact bumps made on the first surface of the first conductive-pattern layer,
- an insulating-material layer on the first surface of the first conductive-pattern layer, and
- a component embedded in the insulating-material layer and having flat contact zones,
- second solderless contact bumps made on the flat contact zones of the component, wherein, the flat contact zones of the component are metallurgically and electrically connected to the first conductive-pattern layer via the first solderless contact bumps made on the first surface of the first conductive-pattern layer and the second solderless contact bumps made on the flat contact zones of the component.
A multi-layered electronic module, comprising a plurality of electronic modules attached on top of each other, wherein each of said plurality of electronic modules comprises:
- a first conductive-pattern layer having a first surface,
- first solderless contact bumps made on the first surface of the first conductive-pattern layer,
- an insulating material layer on the first surface of the first conductive-pattern layer, and
- a component embedded in the insulating-material layer, the component having flat contact zones,
- second solderless contact bumps made on the fiat contact zones of the component, and
- wherein the flat contact zones of the component are metallurgically, electrically and solderlessly connected to the first conductive-pattern layer by means of the second solderless contact bumps made on the fiat contact zones and the first solderless contact bumps made on the first surface of the first conductive-pattern layer.
A multi-layered electronic module, comprising a plurality of electronic modules attached on top of each other, wherein at least one of the modules of said plurality comprises:
- a first conductive-pattern layer having a first surface,
- a second conductive-pattern layer having a second surface,
- an insulating-material layer between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer,
- first solid contact bumps solderlessly made on the first surface of the first conductive-pattern layer and metallurgically and electrically connected thereto,
- a component having flat contact zones embedded in the insulating-material layer,
- second solid contact bump solderlessly made on the flat contact zones and metallurgically and electrically connected thereto, and
- wherein the first solid contact bumps such that the flat contact zones of the component are metallurgically and electrically connected to the first conductive pattern layer via respective first and second solid contact bumps.
Dependencies are inferred from the claim text.