Heat spreader with vapor chamber defined therein

A cooling device, comprising:

• a heat spreader for thermally attaching to a heat-generating device, comprising:
• a bottom wall;
• a cover hermetically connected to the bottom wall to thereby form a sealed space for containing working liquid therein;
• and
• a wick structure received in the space and thermally interconnecting the bottom wall and the cover;
• and
• a heat sink being thermally mounted on the heat spreader;
• wherein the wick structure comprises a plurality of carbon nanotube arrays being evenly spaced from each other;
• and
• wherein a first channel is defined between each two neighboring carbon nanotube arrays, and a second channel is defined at each of two opposite sides of the carbon nanotube arrays, the second channel being perpendicular to and communicating with the first channel.

A cooling device comprising:

• a bottom wall having a bottom surface thermally connecting with a heat-generating electronic component;
• a cover hermetically connected to the bottom wall and defining an inner space with the bottom wall;
• liquid received in the inner space, wherein the liquid evaporates into vapor when the bottom wall receives heat from the heat-generating electronic component;
• and
• carbon nanotubes received in the inner space, thermally interconnecting the bottom wall and the cover and functioning as first wick structure drawing condensed liquid formed by the vapor from the cover toward the bottom wall;
• wherein the carbon nanotubes are divided into a plurality of arrays with a first channel defined between each two neighboring arrays and a second channel at each of opposite sides of the arrays, the first channel communicating with the second channel.