Chip solid electrolyte capacitor and production method of the same
AssigneeShowa Denko K.K.
InventorsKazumi Naito, Katutoshi Tamura
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Abstract
The present invention relates to a resin-molded chip solid electrolyte capacitor comprising a plurality of solid electrolyte capacitor elements horizontally laid in parallel with no gap on a pair of oppositely disposed end parts of a lead frame, and a fixing layer which is extending across the plurality of capacitor elements and fixing the capacitor elements with each other; and having low equivalent series resistance (ESR) and low leakage current (LC value), a production method of the same and an electronic device using the capacitor.
Claims21
A resin-molded chip solid electrolyte capacitor comprising a plurality of solid electrolyte capacitor elements horizontally laid in parallel with no gap on a pair of oppositely disposed end parts of a lead frame, and a fixing layer extending horizontally across the plurality of capacitor elements and fixing the capacitor elements with each other.
A method for producing a chip solid electrolyte capacitor, comprising placing and connecting a plurality of solid electrolyte capacitor elements horizontally in parallel with no gap on a pair of oppositely disposed end parts of a lead frame, stacking a fixing layer which is extending across the plurality of capacitor elements and fixing the capacitor elements with each other, and molding the capacitor elements with a resin while leaving outside the external terminal parts of the lead frame, the solid electrolyte capacitor being produced by stacking an oxide dielectric film layer, a semiconductor layer and an electrically conducting layer in this order to form a cathode part on a surface of an anode substrate exclusive of the anode part at one end comprising a sintered body of a valve-acting metal or an electrically conducting oxide or comprising the sintered body connected with a metal wire.
Dependencies are inferred from the claim text.