US 7,609,461 B1Granted

Optical module having cavity substrate

AssigneeAmkor Technology, Inc.

InventorsSteven Webster, Thomas P. Glenn, Roy Dale Hollaway

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Abstract

A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.

Claims16

Dependent claims

An optical module comprising:

a substrate comprising:
a cavity;
a first interior surface;
a second interior surface formed around a periphery of the first interior surface and extending in a first direction from the first interior surface;
and
a joint surface extending from the second interior surface;
an image sensor coupled in the cavity to the substrate, the image sensor being coupled to the first interior surface with an adhesive;
a lens housing coupled to the substrate, wherein the lens housing comprises a mounting surface comprising:
a first surface coupled to the joint surface;
and
a second surface coupled to the second interior surface of the substrate;
and
an electronic component on a first exterior surface of the substrate.

10 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/315,994Filed 21 Dec 2005 · continuation
Priority: 16 Jan 2001
Granted: 27 Oct 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification24 codes

H10F 39/804
Constructional details of image sensors: containers or encapsulations
G02B 7/02
Mountings, adjusting means, or light-tight connections, for optical elements: for lenses
H04N 23/54
Constructional details: mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
H04N 23/55
Constructional details: optical parts specially adapted for electronic image sensors; Mounting thereof

Family

Application09/764,196Parent of this continuation · filed 16 Jan 2001
US 7,059,040 B1Parent of this continuation
US 7,609,461 B1This patent

From the US filing history. Foreign family members aren’t listed.

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