US 7,609,361 B2 · Substrate processing method and substrate processing system

Abstract

A substrate processing method and a substrate processing system exclude wafers W provided with a protective film having surface defects that will cause components of a resist to dissolve in an immersion liquid during an immersion exposure process, and rated abnormal from those to be processed by the immersion exposure process. The substrate processing system is provided with a protective film forming module for forming a protective film on a resist film formed on a surface of a wafer W, an exposure system 4 for processing the surface of the wafer W coated with a transparent immersion liquid layer by an immersion exposure process, and a developing module 28 for processing the wafer W by a developing process using a developer. A protective film inspecting device 33 detects surface defects in a protective film formed on a wafer W. A control computer 60 decides whether or not surface defects detected by the protective film inspecting device 33 is normal on the basis of information about the surface defects provided by the protective film inspecting device 33, and gives a control signal representing the results of decision to the exposure system 4. The control computer 60 gives an exposure process execution signal requesting processing the wafer W by the exposure process to the exposure system 4 when the surface defects in the protective film are rated normal or gives an exposure process not executing signal requesting not processing the substrate by the exposure process to the exposure system when the surface defects in the protective film are rated abnormal.

Claims2

Dependent claims

A substrate processing method comprising the steps of:

coating a surface of a substrate with a resist film;
coating the surface of the resist film with a protective film;
processing the surface of the substrate by an exposure process with the surface of the substrate coated with a transparent immersion liquid layer;
and
processing the surface of the substrate by a developing process;
wherein surface defects in the surface of the protective film are detected by a protective film inspecting means before subjecting the substrate provided with the protective film to the exposure process by an exposure system, a decision is made to see whether or not the surface defects in the surface of the protective film is normal when the protective film is wetted with the immersion liquid layer, and the substrate is subjected to the exposure process when it is decided that the surface defects are normal or is not subjected to the exposure process when it is decided that the surface defects are abnormal,
wherein the exposure system is provided with an immersion liquid supply unit for supplying the immersion liquid into a space between an exposure lens and the surface of the substrate, a cleaning liquid supply unit for supplying a lens cleaning liquid for cleaning the exposure lens into the space between the exposure lens and the surface of the substrate, and shutoff valves placed in supply lines connected to the immersion liquid supply unit and the cleaning liquid supply unit, respectively, to supply the immersion liquid or the lens cleaning liquid selectively, and the shutoff valves are operated according to the degree of surface defects in the protective film to supply the lens cleaning liquid for a lens cleaning process after the completion of the exposure process when the surface defects in the protective film are normal.

4 more elements

A substrate processing system provided with a resist film forming module for forming a resist film on a surface of a substrate, a protective film forming module for forming a protective film on the resist film, an exposure system for processing the surface of the substrate coated with a transparent immersion liquid layer by an exposure process, and a developing module for processing the substrate by a developing process using a developer;

said substrate processing system comprising:
a protective film inspecting means for inspecting the surface of a protective film formed on a surface of the substrate;
and
a control means that receives information about the result of inspection of the protective film from the protective film inspecting means, rates surface defects in the surface of the protective film, and gives an exposure process execution signal requesting processing the substrate by the exposure process to the exposure system when the surface defects in the protective film are rated normal or gives an exposure process not executing signal requesting not processing the substrate by the exposure process to the exposure system when the surface defects in the protective film are rated abnormal,
wherein the exposure system is provided with an immersion liquid supply unit for supplying an immersion liquid into a space between an exposure lens and the surface of the substrate, a cleaning liquid supply unit for supplying a lens cleaning liquid for cleaning the exposure lens into the space between the exposure lens and the surface of the substrate, and shutoff valves placed in supply lines respectively connected to the immersion liquid supply unit and the cleaning liquid supply unit, respectively, to supply the immersion liquid or the lens cleaning liquid selectively, and the shut off valves are operated by control signals provided by the control means according to the degree of surface defects to supply the lens cleaning liquid for a lens cleaning process after the completion of the exposure process when the surface defects in the protective film are rated normal.

2 more elements

Dependencies are inferred from the claim text.

Substrate processing method and substrate processing system

Life of this patent

Substrate processing method and substrate processing system

Life of this patent

Abstract

Claims2