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AssigneeAvago Technologies Enterprise IP (Singapore) Pte. Ltd.
InventorsMinh van Quach, Nurwati S. Devnani, Robert B. Manley
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Systems, devices and methods are disclosed herein for reducing crosstalk between pairs of differential signal conductors. One or more ground traces connected to one or more over- or under-lying ground planes by vias are located between pairs of differential signal conductors. The electrical shielding provided by the combination of the one or more ground traces and the one or more ground planes results in reduced cross-talk between different pairs of differential signal conductors, and facilitates high-speed data rates between integrated circuits and printed circuit boards. In a preferred embodiment, such ground traces and ground planes are employed in HiTCE packaging containing multiple pairs of differential signal conductors.
An integrated circuit package configured to reduce cross-talk and maintain constant impedance in first and second differential signal conductor pairs incorporated therein, comprising:
A method of making an integrated circuit package configured to reduce cross-talk and maintain constant impedance in first and second differential signal conductor pairs incorporated therein, comprising providing a substrate, providing first and second ground planes disposed above and below the substrate, respectively, providing respective first and second pairs of first and second differential signal conductors disposed within the substrate and substantially in a first plane, providing a third pair of victim conductors disposed within the substrate and substantially in the first plane, the third pair of victim conductors further being disposed between the first and second differential signal conductor pairs;
Dependencies are inferred from the claim text.