Semiconductor device and method of manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorsYasumasa Kasuya, Motoharu Haga
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Abstract
This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip, and a metal plating layer made of a pure metal is formed on the end surface.
Claims14
A semiconductor device comprising:
- a semiconductor chip;
- and
- a lead arranged around the semiconductor chip to extend in a direction intersecting with a side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein
- a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip,
- a first metal plating layer is formed on the joint surface, and
- a second metal plating layer made of a pure metal different from a metal forming the first metal plating layer is formed on the end surface wherein the first and the second metal plating layers are in direct contact with the lead.
A method of manufacturing a semiconductor device using a lead frame integrally comprising a die pad, a lead arranged around the die pad to extend in a direction opposed to the die pad and a support portion connected with an end of the lead farther from the die pad, comprising:
- a bonding step of die-bonding a semiconductor chip onto the die pad and electrically connecting the semiconductor chip and the lead with each other with a bonding wire;
- a sealing step of sealing the semiconductor chip with sealing resin along with the lead frame so that a second surface of the lead opposite to a first surface connected with the bonding wire is exposed from the sealing resin after the bonding step;
- a first plating step of forming a first metal plating layer on the exposed second surface of the lead by electrolytic plating after the sealing step:
- a removing step of removing the support portion and the sealing resin on the support portion and exposing a third surface of the lead orthogonal to the second surface from the sealing resin;
- and
- a second plating step of forming a second metal plating layer made of a pure metal different from a metal forming the first metal plating layer on the exposed third surface of the lead by electroless plating.
Dependencies are inferred from the claim text.