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US 7,608,928 B2Granted
Laminated body and semiconductor device
AssigneesJsr Corporation, Sumitomo Bakelite Co., Ltd.
InventorsKaori Shirato, Atsushi Shiota, Masahiro Tada, Sumitoshi Asakuma
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Abstract
A laminate includes a copper wiring layer (20) provided over a semiconductor layer and having a specific pattern, a protective layer (30) formed of a polybenzoxazole resin layer provided on the copper wiring layer (20), and an insulating layer (40) provided on the protective layer.
Claims10
A laminate comprising:
- a copper wiring layer provided over a semiconductor layer and having a specific pattern;
- a protective layer formed of a polybenzoxazole resin layer provided on the copper wiring layer;
- and
- an insulating layer provided on the protective layer and comprising a silica film and an organic film stacked in layers,
- wherein the organic film is formed of polybenzoxazole and is in contact with the protective layer.
2 more elements
Dependencies are inferred from the claim text.