Relay board with bonding pads connected by wirings
AssigneeFujitsu Microelectronics Limited
InventorYutaka Takinomi
Life of this patent
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Abstract
A relay board provided in a semiconductor package where a plurality of semiconductor chips are provided, the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a lead frame of the semiconductor package and the semiconductor chip, the relay board includes a plurality of wirings each of the wirings connecting at least three bonding pads.
Claims5
A semiconductor device having a structure wherein a relay board is provided on a first semiconductor chip, a second semiconductor chip is provided on the relay board, and the first semiconductor chip, the second semiconductor chip, and the relay board are packaged,
- the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a lead frame of the semiconductor device and the semiconductor chip, comprising:
- a plurality of wirings each of the wirings connecting at least three bonding pads on the relay board, and each of the wiring provided in one of plurality of separated layers of the relay board,
- wherein the first semiconductor chip has an area larger than the relay board, and
- the second semiconductor chip has an area smaller than the relay board.
A semiconductor device, comprising:
- a lead frame;
- a first semiconductor chip provided on the lead frame, the first semiconductor chip having a surface where a plurality of first pads are formed;
- a relay board having an area smaller than an area of the first semiconductor chip, the relay board provided on the first semiconductor chip, the relay board having a surface where a plurality of second pads are formed;
- and
- a second semiconductor chip having an area smaller than an area of the relay board, the second semiconductor chip provided on the relay board, the second semiconductor chip having a surface where a plurality of third pads are formed,
- wherein a wiring connecting at least three of the second pads is formed in the relay board.
Dependencies are inferred from the claim text.