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US 7,608,924 B2Granted
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
AssigneeDelphi Technologies, Inc.
InventorsBruce A. Myers, Joseph M. Ratell
Life of this patent
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Abstract
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.
Claims12
A liquid cooled power electronic circuit, comprising:
- a vertically stacked assembly of liquid cooled semiconductor packages configured for inter-package flow of liquid coolant through the semiconductor packages of said assembly, where each semiconductor package includes a semiconductor chip and a pair of conductive plates that cooperate to enclose the semiconductor chip and that contact terminals of said semiconductor chip, and where juxtaposed plates of said vertically stacked semiconductor packages are electrically joined to provide electrical interconnects between the semiconductor chips enclosed in adjacent packages of said vertically stacked assembly and thereby define one or more power electronic circuits.
Dependencies are inferred from the claim text.