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US 7,608,923 B2Granted
Electronic device with flexible heat spreader
AssigneeVIA Technologies, Inc.
InventorChi-Hsing Hsu
Life of this patent
Estimating the term…
Abstract
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat spreader conformally covers the surface of the substrate and the die. The invention also discloses an electronic device with the package module.
Claims20
A package module, comprising:
- a substrate having a first surface comprising a first die region;
- a first die disposed in the first die region of the first surface on the substrate;
- and
- a first flexible heat spreader conformally covering and directly contacting with the first surface of the substrate and the first die, one end of the first flexible heat spreader is bonded to a circuit board.
1 more element
An electronic device, comprising:
- a package module, comprising:
- a substrate having a first surface and an opposing second surface, wherein the first surface comprises a first die region;
- a plurality of solder balls on the second surface of the substrate arranged in an array;
- a first die disposed in the first die region of the first surface on the substrate;
- a first flexible heat spreader conformally covering and directly contacting with the first surface of the substrate and the first die;
- and
- a circuit board having a plurality of bonding pads correspondingly bonded to the plurality of solder balls.
4 more elements
Dependencies are inferred from the claim text.