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US 7,608,855 B2Granted
Polymer dielectrics for memory element array interconnect
AssigneeSpansion LLC
InventorChristopher F. Lyons
Life of this patent
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Abstract
Disclosed are semiconductor devices containing a polymer dielectric and at least one active device containing an organic semiconductor material and a passive layer. Also disclosed are semiconductor devices further containing a conductive polymer. Such devices are characterized by light weight and robust reliability.
Claims20
A semiconductor device, comprising:
- a substrate;
- a polymer dielectric over the substrate;
- and
- at least one active device comprising an organic semiconductor material and a passive layer,
- wherein coefficients of thermal expansion of the polymer dielectric and organic semiconductor material are substantially matched.
2 more elements
A semiconductor device, comprising:
- a substrate;
- a polymer dielectric over the substrate;
- at least one active device comprising an organic semiconductor material and a passive layer;
- and
- a conductive polymer adjacent at least one active device,
- wherein coefficients of thermal expansion of the polymer dielectric and organic semiconductor material are substantially matched.
3 more elements
Dependencies are inferred from the claim text.