Component arrangement provided with a carrier substrate

A component arrangement comprising:

• a carrier substrate;
• a component on the carrier substrate;
• and
• a cover layer on the carrier substrate, the cover layer being over the component and forming a seal with the carrier substrate to seal the component;
• wherein the carrier substrate comprises:
• at least two layers of glass film, the at least two layers of glass film comprising a first glass film and a second glass film, and
• an intermediate layer over the first glass film;
• wherein a recess in the carrier substrate extends along an exterior of the component, the recess extending through the first glass film from a side of the carrier substrate facing the component to a contact plane;
• wherein the contact plane comprises the second glass film and a metallization on the second glass film;
• and
• wherein the cover layer is electrically connected to the metallization that is part of the contact plane.