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US 7,608,534 B2Granted
Interconnection of through-wafer vias using bridge structures
AssigneeAnalog Devices, Inc.
InventorsChanghan Yun, Javier Villarreal, Maurice S. Karpman
Life of this patent
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Abstract
Bridge structures provide a surface on which to form interconnections to components through through-hole vias. The bridge structures at least partially, and preferably fully, span the gap between two wafers, and, more specifically, between a through-hole via in one wafer and a corresponding component on the other wafer. Bridge structure may be formed on the wafer having the through-hole via and/or the wafer having the component.
Claims20
A method for forming an interconnection in a capped or stacked wafer device, the method comprising:
- forming a bridge structure on a first wafer device;
- bonding the first wafer device to a second wafer device such that the bridge structure at least partially spans a gap between a through-hole via in one of the wafers and a corresponding component on the other wafer;
- and
- forming an interconnection to the component through the through-hole via across the bridge structure.
1 more element
Apparatus comprising:
- a first wafer having a component;
- a second wafer bonded to the first wafer, the second wafer having a through-hole via;
- at least one bridge structure formed on one of the wafers, wherein the bridge structure at least partially spans a gap between the through-hole via and the component;
- and
- an interconnection formed through the through-hole via to the component across the bridge structure.
2 more elements
Dependencies are inferred from the claim text.