Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier

A device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising:

• first and second co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity that encloses at least a portion of the carrier, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and
• feed means, for encapsulating material connecting onto at least one projecting edge under which is located a receiving space for a part of the carrier, wherein the projecting edge forms a stationary assembly with the first mould part, and the first mould part also receives a movable support for the carrier that is displaceable within the first mould part relative to the edge such that the carrier can be urged against the projecting edge with a controllable force.