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US 7,608,472 B2Granted
Light emitting element and method of making same
AssigneeKoha Co., Ltd.
InventorsNoboru Ichinose, Kiyoshi Shimamura, Yukio Kaneko, Encarnacion Antonia Garcia Villora, Kazuo Aoki
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Abstract
A light emitting element has a substrate of gallium oxides and a pn-junction formed on the substrate. The substrate is of gallium oxides represented by: (AlXInYGa(1-X-Y))2O3 where 0≦x≦1, 0≦y≦1 and 0≦x+y≦1. The pn-junction has first conductivity type substrate, and GaN system compound semiconductor thin film of second conductivity type opposite to the first conductivity type.
Claims2
A method of making a light emitting element, comprising the steps of:
- growing a single crystal substrate including gallium as the major component by EFG (Edge-defined film Fed Growth) method where, in a high-temperature vessel of a controlled atmosphere, using a slit die that allows source material melt to be continually lifted above the slit die through the capillary phenomenon of a slit provided with the slit die and a crucible that accommodates the slit die and the source material melt, single crystal the cross section of which has the same shape as the top surface of the slit die is grown;
- and
- growing compound semiconductor thin film on said substrate.
A method of making a light emitting element, comprising the steps of:
- providing single crystalline Ga2O3 system seed crystal and non-single crystalline Ga2O3 system material;
- growing a single crystal substrate including gallium as the major component by FZ(Floating Zone) method where said Ga2O3 system seed crystal and Ga2O3 system material are contacted and heated such that said Ga2O3 system seed crystal and Ga2O3 system material are melted at the contacting portion, thereby crystallize said Ga2O3 system material;
- and
- growing compound semiconductor thin film on said substrate.
1 more element
Dependencies are inferred from the claim text.