US 7,608,469 B2 · Method of fabricating a chip

Abstract

A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Claims17

Dependent claims

A method of fabricating a integrated circuit device, the method comprising the steps of:

a) providing a first electrical part, a second electrical part, and a connector;
b) forming a shell, the shell having a top surface and a cavity disposed within the top surface, the first electrical part being embedded within the shell, the connector being electrically connected to the first electrical part and having an exposed portion extending into the cavity;
c) providing a tester adapted to generate a first input signal and process a first response signal associated with the first input signal;
d) communicating the first input signal to the first electrical part, the first electrical part being configured to generate the first response signal upon receipt of the first input signal if the first electrical part is functional;
e) transmitting the first response signal from the first electrical part to the tester;
f) disposing the second electrical part in the cavity and electrically connecting the second electrical part to the connector;
and
g) filling the cavity with a filler material to at least partially embed the second electrical part within the filler material.

5 more elements

A method of fabricating an integrated circuit device, the method comprising the steps of:

a) providing a first electrical part, a second electrical part, and a connector, the first electrical part being configured to perform a first function and a second function;
b) forming a shell, the shell having a top surface and a cavity disposed within the top surface, the first electrical part being embedded within the shell, the connector being electrically connected to the first electrical part and having an exposed portion extending into the cavity;
c) providing a tester adapted to generate a first test signal and a second test signal and process a first response signal and a second response signal, the first response signal being associated with the first test signal and the second response signal being associated with the second test signal;
d) communicating the first test signal and the second test signal to the first electrical part, the first electrical part being configured to generate the first response signal upon receipt of the first test signal when the first function of the first electrical part is functional, the first electrical part being configured to generate the second response signal upon receipt of the second test signal when the second function of the first electrical part is functional;
e) transmitting the first response signal and the second response signal from the first electrical part to the tester;
and
f) disposing the second electrical pad in the cavity and electrically connecting the second electrical part to the connector.

4 more elements

Dependencies are inferred from the claim text.

Method of fabricating a chip

Life of this patent

Method of fabricating a chip

Life of this patent

Abstract

Claims17