Water-permeable adhesive tape
AssigneesNitto Denko Corporation, Nitto Europe N.V.
InventorsWalter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada
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Abstract
The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
Claims19
An adhesive tape for processing semiconductor wafers and/or semiconductor related materials, comprising (i) an adhesive tape and (ii) a semiconductor wafer or a semiconductor material affixed to the adhesive tape, the adhesive tape comprising at least one water-permeable base film and an adhesive applied only on one surface of the at least one water-permeable base film, and the at least one water-permeable base film possesses perforations and has a cavity ratio of 3.0 to 90%.
An adhesive tape for processing semiconductor wafers and/or semiconductor related materials, comprising (i) an adhesive tape and (ii) a semiconductor wafer or a semiconductor material affixed to the adhesive tape, the adhesive tape comprising at least one water-permeable base film and an adhesive applied on one surface of the at least one water-permeable base film, and the at least one water-permeable base film possesses artificial perforations and has a cavity ratio of 3 to 60%.
Dependencies are inferred from the claim text.