Thermally conductive EMI shield

A thermally conductive composite material for reducing electromagnetic emissions generated by an electronic device, said thermally conductive composite material comprising:

• a thermally conductive material in particulate form;
• and
• an electromagnetic-energy-absorptive material in particulate form,
• said thermally conductive material and said electromagnetic-energy-absorptive material being suspended within a polymeric base material, said polymeric base material being substantially transparent to electromagnetic energy, said polymeric base material comprising a phase-change material and up to 19.35% by weight of ethylene-vinyl acetate, the phase-change material comprising a paraffin wax or a synthetic wax, wherein the phase-change material has a reflow temperature that allows the thermally conductive material in particulate form that is suspended within the polymeric base material to flow into gaps and thereby at least reduce thermal impedance,
• wherein said thermally conductive composite material is configured such that when placed between an electronic device and a proximate structure, said thermally conductive material is operable for facilitating transfer of thermal energy from said electronic device and said electromagnetic-energy-absorptive material is operable for reducing electromagnetic emissions generated by the device, and
• wherein the electromagnetic-energy-absorptive material includes carbonyl iron.