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US 7,608,304 B2Granted
Substrate carrying method and substrate carrying apparatus
AssigneeSeiko Epson Corporation
InventorMinoru Koyama
Life of this patent
Estimating the term…
Abstract
A substrate carrying method for removing the electrical charges on a substrate and then carrying the substrate includes forming a conductive layer with conductivity on a part of the surface of the substrate, and carrying the substrate while supporting a conductive layer-forming region of the substrate by a grounded substrate supporting unit with conductivity.
Claims8
A substrate carrying method for removing electrical charges on a substrate while the substrate is being transported by a substrate supporting unit, the method comprising:
- providing a substrate supporting unit having three rows of rollers that are parallel to each other;
- determining first and second paths, on opposite edges of a surface of the substrate respectively, through which two rows of the rollers of the substrate supporting unit travel during transportation of the substrate;
- determining a cutting line of the substrate in the middle of the substrate and parallel to each of the first and second paths;
- forming only three conductive strips with conductivity on the surface of the substrate to cover the first path, the second path, and the cutting line respectively;
- and
- transporting the substrate by the substrate supporting unit, wherein each row of the three rows of rollers of the grounded substrate supporting unit is in contact only with a respective one of the three conductive strips during transportation of the substrate;
- cutting the substrate into two pieces along the cutting line.
4 more elements
A system, comprising:
- a grounded substrate supporting unit with conductivity having three rows of rollers that are parallel to each other,
- a substrate having only three conductive strips including
- first and second conductive strips with conductivity formed on opposite edges of a surface of the substrate, respectively, and
- a third conductive strip with conductivity formed on a cutting line of the substrate, wherein the cutting line is in the middle of the substrate and is parallel to each of the first and second conductive strips, and
- wherein the substrate is supported by the substrate supporting unit, wherein each of the three rows of rollers of the grounded substrate supporting unit is in contact with a respective one of the first, second, and third conductive strips of the substrate.
2 more elements
A system, comprising:
- a grounded substrate supporting having first and second guide rails as well as a row of rollers that are between and parallel to the guide rails,
- a substrate having only three conductive strips including
- first and second conductive strips with conductivity formed on opposite edges of a surface of the substrate, respectively, and
- a third conductive strip formed on a cutting line of the substrate, wherein the cutting line is in the middle of the substrate and is parallel to each of the first and second conductive strips, and
- wherein the substrate is supported by the substrate supporting unit, wherein each of the first and second guide rails guides the substrate and is in contact with a respective one of the first and second conductive strips of the substrate, wherein the row of rollers is in contact with the third conductive strip.
2 more elements
Dependencies are inferred from the claim text.