US 7,608,295 B2Granted

Polyimide compositions and use thereof in ceramic product defect repair

AssigneeInternational Business Machines Corporation

InventorsKrishna G Sachdev, Michael Berger, Gregg Monjeau, Robert A. Rita, Kathleen M Wiley

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Abstract

A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

Claims8

Dependent claims

A method of repairing a ceramic substrate comprising the steps of:

providing a ceramic substrate having a defect;
coating the defect region with a polyamic acid composition comprising an aromatic diamine monomer and an aromatic dianhydride monomer, where both of the monomers are flexible and a stoichiometric excess of one of the monomers is used, and subsequently endcapping with an amine or anhydride depending on which monomer was used in excess, and wherein the dianhydride monomer is oxydiphthalic anhydride (ODPA) and the aromatic diamine monomer is 1,3-bis(3′-aminophenoxy)benzene (1,3,3′-APB) or the dianhydride monomer is ODPA and the diamine monomer is a mixture of 1,3,3′-APB and one or both of 4,4′-oxydianiline (4,4′-ODA) and 3,4′-oxydianiline (3,4′-ODA);
and
curing the polyamic acid coating to form a flexible polyimide.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 11/684,679Filed 12 Mar 2007 · division
Priority: 8 Jan 2003
Published: US 2007/0154631 A15 Jul 2007
Granted: 27 Oct 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification22 codes

H05K 3/386
Improvement of the adhesion between the insulating substrate and the metal: by the use of an organic polymeric bonding layer, e.g. adhesive
C03C 17/32
With organic material: with synthetic or natural resins
C04B 41/009
After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone: characterised by the material treated
C04B 41/488
Macromolecular compounds: other macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds

Family

Application10/338,927Parent of this division · filed 8 Jan 2003
US 2007/0154631 A1Pre-grant publication · published 5 Jul 2007
US 2004/0132900 A1Published application
US 7,608,295 B2This patent

From the US filing history. Foreign family members aren’t listed.

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